RAK3272S Breakout Board is specifically designed to allow easy access to the pins on the board in order to simplify development and testing. The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers. Its firmware is based on RAKwireless Unified Interface V3 (RUI3) that allows you create different functionalities using RUI APIs.

The board itself has the RAK3172 at its core, integrating a STM32WLE5CC chip, It has Ultra-Low Power Consumption of 1.69uA in sleep mode

This module complies with Class A, B & C of LoRaWAN 1.0.3 specifications. It also supports LoRa Point to Point (P2P) communication mode which helps you in implementing your own customized long-range LoRa network quickly.

Product Features

• Based on RAK3172
• I/O ports: UART/I2C/GPIO/SPI
• Serial Wire Debug (SWD) interface
• Module size: 25.4 x 32.3 mm
• Supply Voltage: 2.0 V ~ 3.6 V
• Temperature Range: -40° C ~ 85° C

Product Inclusion

• 1pc RAK3272S Breakout Board US 915 MHz
• 1pc LoRa® antenna with RP-SMA female connector
• 18pcs Dupont lines

Documentation

• RAK3272 Breakout Board Datasheet

Warranty & Support:

Complimentary Telephone and Email/Live Chat Support (Click Here)
Online Technical Manuals and Instructions (Click Here)

Sales tax is required in many states and will be added at checkout if applicable to your delivery state. Tax exempt forms can be sent to our support department.

Return Policy: Due to the high demand for this product, all sales for this product are final and we don’t accept returns or cancelations, and we are not able to issue a refund.